Today, during the 83rd China Educational Equipment Exhibition, the Intel AI Education Summit and the global launch event for OPS 2.0 were successfully held. At the summit, Intel, in partnership with companies such as CVTE and Dashengda, officially unveiled the next-generation Open Pluggable Specification—OPS 2.0. The event also showcased a variety of industry-leading solutions based on this standard, aiming to further accelerate the innovation and implementation of smart education terminals and intelligent applications, thereby creating a future-oriented new ecosystem for smart education.